By Vishay Semiconductor / Opto Division 91
Vishay’s AEC-Q101-qualified, surface-mount devices offer high reverse light current to 48 µA and low dark current of 2 nA. These devices are manufactured using Vishay's foil assisted mold (FAM) technology. The photodiodes' lead frame, bond wire, and connection pads are molded in a black epoxy, while a free cavity above the radiant sensitive area allows light to enter the package for signal generation. This design enables a smaller overall package size with a lower height profile, while maintaining a large radiant sensitive area. In addition, thermal stress on the bond is reduced for increased robustness and reliability.
The photodiodes are optimized for photo detection in applications such as rain, light, tunnel sensors, smoke detectors, wearable electronics, data transmission, and road cash systems. For the detection of visible and near infrared radiation, the VEMD5010X01's free cavity is filled with a clear epoxy for a wide sensitivity range from 430 nm to 1100 nm. For 790 nm to 1050 nm infrared applications, the VEMD5110X01 utilizes a black daylight filtering epoxy and is matched with 850 nm to 940 nm IR emitters.
The VEMD5010X01 and VEMD5110X01 feature fast response times, ±65° angles of half sensitivity, a wide temperature range of -40°C to +110°C, and 940 nm wavelengths of peak sensitivity. RoHS-compliant, halogen-free, and Vishay green, the photodiodes provide a moisture sensitivity level (MSL) of 4 in accordance with J-STD-020 for a floor life of 72 hours.
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