XCKU11P-3FFVD900E

Mfr. #:: XCKU11P-3FFVD900E
Produttore:: Xilinx
Descrizione:: FPGA - Field Programmable Gate Array
Ciclo vitale:: Nuovo da questo produttore.
Scheda dati:: XCKU11P-3FFVD900E Scheda dati
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Maggiori informazioni:: XCKU11P-3FFVD900E maggiori informazioni XCKU11P-3FFVD900E Product Details

Attributo del prodotto
Valore attributo

Produttore:: Xilinx

Categoria di prodotto:: FPGA - Array di gate programmabile sul campo

RoHS:: Y

Prodotto:: Kintex UltraScale+

Numero di elementi logici:: 653100

Numero di I/O:: 424 I/O

Tensione di alimentazione operativa:: 0.85 V

Temperatura di esercizio minima:: 0 C

Temperatura massima di esercizio:: + 100 C

Stile di montaggio:: SMD/SMT

Pacchetto/custodia:: FBGA-900

Velocità dati:: 32.75 Gb/s

Serie:: XCKU11P

Marca:: Xilinx

RAM distribuita:: 9.1 Mbit

RAM a blocchi incorporati - EBR:: 21.1 Mbit

Numero di ricetrasmettitori:: 52 Transceiver

Tipologia di prodotto:: FPGA - Array di gate programmabile sul campo

Quantità confezione di fabbrica:: 1

sottocategoria:: CI logici programmabili

Nome depositato:: Kintex UltraScale+

Tags: XCKU11P-3, XCKU11P, XCKU11, XCKU1, XCKU, XCK

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We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

XCKU11P-3FFVD900E Maggiori informazioni

Kintex® UltraScale+ Field Programmable Gate Arrays: Xilinx Kintex® UltraScale+™ Field Programmable Gate Arrays feature power options that deliver optimal balance between the required system performance and the smallest power envelope. FPGAs are semiconductor devices that are based around a matrix of configurable logic blocks (CLBs) connected via programmable interconnects. Kintex UltraScale+ devices are ideal for both packet processing and DSP-intensive functions, and for applications ranging from wireless MIMO technology to Nx100G networking and data center.

Market price

Parte #	Mfg.	Descrizione	Azione	Prezzo
XCKU11P-3FFVD900E DISTI # XCKU11P-3FFVD900E-ND	Xilinx	XCKU11P-3FFVD900E RoHS: Compliant Min Qty: 1 Container: Tray	Temporarily Out of Stock	1:$4,206.6000
XCKU11P-3FFVD900E DISTI # XCKU11P-3FFVD900E	Xilinx	XCKU11P-3FFVD900E - Trays (Alt: XCKU11P-3FFVD900E) RoHS: Compliant Min Qty: 1 Container: Tray	Americas - 0	1:$4,275.0000

Prodotti correlati

Immagine	Parte #	Descrizione
	Mfr.#: XCKU11P-2FFVD900E OMO.#: OMO-XCKU11P-2FFVD900E	FPGA - Field Programmable Gate Array
	Mfr.#: XCKU11P-2FFVD900I OMO.#: OMO-XCKU11P-2FFVD900I	FPGA - Field Programmable Gate Array
	Mfr.#: XCKU11P-L1FFVE1517I OMO.#: OMO-XCKU11P-L1FFVE1517I	FPGA - Field Programmable Gate Array
	Mfr.#: XCKU11P-1FFVA1156E OMO.#: OMO-XCKU11P-1FFVA1156E-XILINX	XCKU11P-1FFVA1156E
	Mfr.#: XCKU11P-2FFVA1156E OMO.#: OMO-XCKU11P-2FFVA1156E-XILINX	XCKU11P-2FFVA1156E
	Mfr.#: XCKU11P-2FFVA1156I OMO.#: OMO-XCKU11P-2FFVA1156I-XILINX	XCKU11P-2FFVA1156I
	Mfr.#: XCKU11P-2FFVD900E OMO.#: OMO-XCKU11P-2FFVD900E-XILINX	XCKU11P-2FFVD900E
	Mfr.#: XCKU11P-3FFVD900E OMO.#: OMO-XCKU11P-3FFVD900E-XILINX	XCKU11P-3FFVD900E
	Mfr.#: XCKU11P-L1FFVA1156I OMO.#: OMO-XCKU11P-L1FFVA1156I-XILINX	XCKU11P-L1FFVA1156I
	Mfr.#: XCKU11P-L2FFVA1156E OMO.#: OMO-XCKU11P-L2FFVA1156E-XILINX	XCKU11P-L2FFVA1156E

Disponibilità

Azione:: Available
Su ordine:: 5500
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Il prezzo attuale di XCKU11P-3FFVD900E è solo di riferimento, se si desidera ottenere il prezzo migliore, inviare una richiesta o inviare un'e-mail diretta al nostro team di vendita [email protected]

Prezzo di riferimento (USD)

Quantità
Prezzo unitario
est. Prezzo

1: ~~4 014,26 USD~~; ~~4 014,26 USD~~

Iniziare con

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XCKU11P-3FFVD900E

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes