CG8177AMT

CG8177AMT
Mfr. #:
CG8177AMT
Produttore:
Cypress Semiconductor
Descrizione:
IC MCU CAPSENSE
Ciclo vitale:
Nuovo da questo produttore.
Scheda dati:
CG8177AMT Scheda dati
Consegna:
DHL FedEx Ups TNT EMS
Pagamento:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Maggiori informazioni:
CG8177AMT maggiori informazioni CG8177AMT Product Details
Attributo del prodotto
Valore attributo
Tags
CG817, CG81, CG8
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
Parte # Mfg. Descrizione Azione Prezzo
CG8177AMT
DISTI # CG8177AMT-ND
Cypress SemiconductorIC MCU CAPSENSE
RoHS: Compliant
Container: Tape & Reel (TR)
Limited Supply - Call
    CG8177AMT
    DISTI # 727-CG8177AMT
    Cypress SemiconductorCapacitive Touch Sensors CapSensePLUS
    RoHS: Compliant
    0
      Immagine Parte # Descrizione
      CG8155AA

      Mfr.#: CG8155AA

      OMO.#: OMO-CG8155AA

      SRAM Sync SRAMs
      CG8178AAT

      Mfr.#: CG8178AAT

      OMO.#: OMO-CG8178AAT-CYPRESS-SEMICONDUCTOR

      IC SRAM ASYNC
      CG8100AA

      Mfr.#: CG8100AA

      OMO.#: OMO-CG8100AA-CYPRESS-SEMICONDUCTOR

      IC SRAM 100TQFP
      CG8192AAT

      Mfr.#: CG8192AAT

      OMO.#: OMO-CG8192AAT-241

      IC SRAM SYNC
      CG8136AM

      Mfr.#: CG8136AM

      OMO.#: OMO-CG8136AM-CYPRESS-SEMICONDUCTOR

      IC SRAM ASYNC
      CG8177AMT

      Mfr.#: CG8177AMT

      OMO.#: OMO-CG8177AMT-CYPRESS-SEMICONDUCTOR

      IC MCU CAPSENSE
      CG8199AA

      Mfr.#: CG8199AA

      OMO.#: OMO-CG8199AA-CYPRESS-SEMICONDUCTOR

      IC SRAM
      CG8170AA

      Mfr.#: CG8170AA

      OMO.#: OMO-CG8170AA--1

      Nuovo e originale
      CG8185AAT

      Mfr.#: CG8185AAT

      OMO.#: OMO-CG8185AAT-CYPRESS-SEMICONDUCTOR

      Nuovo e originale
      CG8188AAT

      Mfr.#: CG8188AAT

      OMO.#: OMO-CG8188AAT-CYPRESS-SEMICONDUCTOR

      Nuovo e originale
      Disponibilità
      Azione:
      Available
      Su ordine:
      5500
      Inserisci la quantità:
      Il prezzo attuale di CG8177AMT è solo di riferimento, se si desidera ottenere il prezzo migliore, inviare una richiesta o inviare un'e-mail diretta al nostro team di vendita [email protected]
      Prezzo di riferimento (USD)
      Quantità
      Prezzo unitario
      est. Prezzo
      1
      0,00 USD
      0,00 USD
      10
      0,00 USD
      0,00 USD
      100
      0,00 USD
      0,00 USD
      500
      0,00 USD
      0,00 USD
      1000
      0,00 USD
      0,00 USD
      Iniziare con
      Prodotti più recenti
      • PSoC® 4 BLE 256 KB Module with Bluetooth®
        Cypress' PSoC 4 BLE 256 KB device, two crystals for the antenna matching network, a PCB antenna and other passives, while providing access to all GPIOs of the device.
      • T543 Series COTS Polymer Electrolytic
        KEMET Organic Capacitor (KO-CAP) is a solid electrolytic capacitor with a conductive polymer cathode capable of delivering low ESR and capacitance retention at high frequencies.
      • HK Series Inductors
        TAIYO YUDEN's HK series inductors have expanded to include price competitive, AEC-Q200 qualified high-reliability version inductors.
      • Piezoelectric Acoustic Modules
        KEMET's multilayer piezoelectric bimorph actuators are ceramic elements used to convert electrical energy into mechanical energy such as displacement or force.
      • CY8CKIT-042-BLE Bluetooth® Low Energy Develop
        The Cypress CY8CKIT-042-BLE development kit supports system-level designs including example projects to enable Bluetooth Low Energy mixed-signal embedded designs.
      Top