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| PartNumber | SIDC38D60C8X1SA1 | SIDC38D65C8AX7SA1 | SIDC38D65C8X1SA1 |
| Description | DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D60C8X1SA1) | Fast switching diode chip in EMCON 3 -Technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D65C8X1SA1) |
| Produttore | Parte # | Descrizione | RFQ |
|---|---|---|---|
| SIDC38D60C8X1SA1 | DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D60C8X1SA1) | ||
| SIDC38D65C8AX7SA1 | Nuovo e originale | ||
| SIDC38D65C8X1SA1 | Fast switching diode chip in EMCON 3 -Technology - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC38D65C8X1SA1) | ||
| SIDC38D65C8X1SA1INFINEON | Nuovo e originale | ||
Infineon Technologies |
SIDC38D60C6X1SA3 | DIODE GEN PURP 600V 150A WAFER |