LDB311G800

LDB311G8002C-300 1800M vs LDB311G8005C-461 vs LDB311G8005C-300

 
PartNumberLDB311G8002C-300 1800MLDB311G8005C-461LDB311G8005C-300
DescriptionSignal Conditioning 1206 1.80GHz 50ohm Baluns
Manufacturer--MURATA
Product Category--IC Chips
Series--LDB
Product--Baluns
Type--Chip Multilayer Hybrid Balun
Packaging--Reel
Unit Weight--0.000353 oz
Termination Style--SMD/SMT
Mounting--SMD/SMT
Operating Temperature Range--- 40 C to + 85 C
Frequency--1.8 GHz
Impedance--50 Ohms
Frequency Range--1700 MHz to 1900 MHz
Package Case--1206 (3216 metric)
Produttore Parte # Descrizione RFQ
LDB311G8002C-300 1800M Nuovo e originale
LDB311G8005C-461 Nuovo e originale
LDB311G8005C-300 Signal Conditioning 1206 1.80GHz 50ohm Baluns
Top