808-AG11D-E

808-AG11D-ES vs 808-AG11D-ESL vs 808-AG11D-ES-LF

 
PartNumber808-AG11D-ES808-AG11D-ESL808-AG11D-ES-LF
DescriptionIC & Component Sockets 8 PIN ECONOMYIC & Component Sockets 8P DIP SOCKETIC & Component Sockets DIP .3CL 08P S&R OFRM AU/SN
ManufacturerTE Connectivity-TE Connectivity AMP Connectors
Product CategoryIC & Component Sockets-Sockets for ICs, Transistors
RoHSN--
Pitch2.54 mm--
Contact PlatingGold--
BrandTE Connectivity / AMP--
Contact MaterialBeryllium Copper--
Mounting StylePCB--
Maximum Operating Temperature+ 125 C--
Minimum Operating Temperature- 55 C--
Product TypeIC & Component Sockets--
Factory Pack Quantity60--
SubcategoryIC & Component Sockets--
Part # Aliases1437539-5--
Series--800
Type--DIP, 0.3" (7.62mm) Row Spacing
Packaging--Tube
Termination--Solder
Operating Temperature---55°C ~ 105°C
Mounting Type--Through Hole
Features--Open Frame
Housing Material--Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Number of Positions or Pins Grid--8 (2 x 4)
Pitch Mating--0.100" (2.54mm)
Contact Finish Mating--Gold
Pitch Post--0.100" (2.54mm)
Contact Finish Post--Gold
Contact Finish Thickness Mating--20μin (0.51μm)
Contact Material Mating--Beryllium Copper
Contact Finish Thickness Post--20μin (0.51μm)
Contact Material Post--Copper
Produttore Parte # Descrizione RFQ
TE Connectivity / AMP Connectors
TE Connectivity / AMP Connectors
808-AG11D-ES IC & Component Sockets 8 PIN ECONOMY
808-AG11D-ESL IC & Component Sockets 8P DIP SOCKET
808-AG11D-ESL-L Nuovo e originale
TE Connectivity
TE Connectivity
808-AG11D-ES-LF IC & Component Sockets DIP .3CL 08P S&R OFRM AU/SN
808-AG11D-ES IC & Component Sockets 8 PIN ECONOMY
808-AG11D-ESL-LF IC & Component Sockets DIP .3CL 08P S&R OFRM AU/SN
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