 | | | |
| PartNumber | 48-3574-16 | 48-3574-11 | 48-3574-10 |
| Description | IC & Component Sockets QUICK RELEASE 48 PIN NICKEL | IC & Component Sockets QUICK RELEASE 48 PIN GOLD | IC & Component Sockets QUICK RELEASE 48 PIN TIN |
| Manufacturer | Aries Electronics | - | Aries Electronics |
| Product Category | Sockets for ICs, Transistors | - | Sockets for ICs, Transistors |
| Series | 57 | - | 57 |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | - | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Packaging | Bulk | - | Bulk |
| Termination | Solder | - | Solder |
| Operating Temperature | - | - | - |
| Mounting Type | Through Hole | - | Through Hole |
| Features | Closed Frame | - | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled | - | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins Grid | 48 (2 x 24) | - | 48 (2 x 24) |
| Pitch Mating | 0.100" (2.54mm) | - | 0.100" (2.54mm) |
| Contact Finish Mating | Tin | - | Tin |
| Pitch Post | 0.100" (2.54mm) | - | 0.100" (2.54mm) |
| Contact Finish Post | Tin | - | Tin |
| Contact Finish Thickness Mating | 200μin (5.08μm) | - | 200μin (5.08μm) |
| Contact Material Mating | Beryllium Copper | - | Beryllium Copper |
| Contact Finish Thickness Post | 200μin (5.08μm) | - | 200μin (5.08μm) |
| Contact Material Post | Beryllium Copper | - | Beryllium Copper |
| Produttore | Parte # | Descrizione | RFQ |
|---|---|---|---|
Aries Electronics |
48-3574-18 | IC & Component Sockets QUICK RELEASE 48 PIN HI TEMP | |
| 48-3574-18 | IC & Component Sockets QUICK RELEASE 48 PIN HI TEMP | ||
| 48-3574-16 | IC & Component Sockets QUICK RELEASE 48 PIN NICKEL | ||
| 48-3574-11 | IC & Component Sockets QUICK RELEASE 48 PIN GOLD | ||
| 48-3574-10 | IC & Component Sockets QUICK RELEASE 48 PIN TIN |