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| PartNumber | 36-6553-16 | 36-6553-11 | 36-6553-10 |
| Description | IC & Component Sockets DIP TEST SCKT NICKEL 36 PINS | IC & Component Sockets DIP TEST SCKT GOLD 36 PINS | IC & Component Sockets DIP TEST SCKT TIN 36 PINS |
| Manufacturer | - | Aries Electronics | Aries Electronics |
| Product Category | - | Sockets for ICs, Transistors | Sockets for ICs, Transistors |
| Series | - | 55 | 55 |
| Type | - | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Packaging | - | Bulk | Bulk |
| Termination | - | Solder | Solder |
| Operating Temperature | - | - | - |
| Mounting Type | - | Through Hole | Through Hole |
| Features | - | Closed Frame | Closed Frame |
| Housing Material | - | Polyphenylene Sulfide (PPS), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled |
| Number of Positions or Pins Grid | - | 36 (2 x 18) | 36 (2 x 18) |
| Pitch Mating | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Mating | - | Nickel Boron | Gold |
| Pitch Post | - | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Contact Finish Post | - | Nickel Boron | Gold |
| Contact Finish Thickness Mating | - | 50μin (1.27μm) | - |
| Contact Material Mating | - | Beryllium Copper | Beryllium Copper |
| Contact Finish Thickness Post | - | 50μin (1.27μm) | - |
| Contact Material Post | - | Beryllium Copper | Beryllium Copper |