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| PartNumber | ED281256P55QB | ED2897 | ED28DT |
| Description | CONN IC DIP SOCKET 28POS TIN | ||
| Manufacturer | - | - | On Shore Technology Inc. |
| Product Category | - | - | Sockets for ICs, Transistors |
| Series | - | - | ED |
| Type | - | - | DIP, 0.6" (15.24mm) Row Spacing |
| Packaging | - | - | Tube |
| Termination | - | - | Solder |
| Operating Temperature | - | - | -55°C ~ 110°C |
| Mounting Type | - | - | Through Hole |
| Features | - | - | Open Frame |
| Housing Material | - | - | Polybutylene Terephthalate (PBT), Glass Filled |
| Number of Positions or Pins Grid | - | - | 28 (2 x 14) |
| Pitch Mating | - | - | 0.100" (2.54mm) |
| Contact Finish Mating | - | - | Tin |
| Pitch Post | - | - | 0.100" (2.54mm) |
| Contact Finish Post | - | - | Tin |
| Contact Finish Thickness Mating | - | - | 60μin (1.52μm) |
| Contact Material Mating | - | - | Phosphor Bronze |
| Contact Finish Thickness Post | - | - | 60μin (1.52μm) |
| Contact Material Post | - | - | Phosphor Bronze |