814-AG11D vs 814-AG11D-ES vs 814-AG11D-ES-LF

 
PartNumber814-AG11D814-AG11D-ES814-AG11D-ES-LF
DescriptionIC & Component Sockets 14 PIN DIP SOCKETIC & Component Sockets PC MOUNT 14 PINSIC & Component Sockets DIP .3CL 14P S&R OFRM AU/SN
ManufacturerTE ConnectivityTE Connectivity AMP Connectors
Product CategoryIC & Component SocketsSockets for ICs, TransistorsIC Chips
RoHSN-Details
ProductDIP / SIP Sockets-DIP / SIP Sockets
Pitch2.54 mm-2.54 mm
Contact PlatingGold-Gold
BrandTE Connectivity / AMP-TE Connectivity
Contact MaterialBeryllium Copper--
Mounting StyleSMD/SMT-PCB
Maximum Operating Temperature+ 125 C--
Minimum Operating Temperature0 C--
Product TypeIC & Component Sockets--
Factory Pack Quantity34--
SubcategoryIC & Component Sockets--
Part # Aliases2-1437537-4-4-1571552-2
Series-800-
Type-DIP, 0.3" (7.62mm) Row SpacingDIP
Packaging-TubeTube
Termination-Solder-
Operating Temperature--55°C ~ 105°C-
Mounting Type-Through Hole-
Features-Open Frame-
Housing Material-Polyester-
Number of Positions or Pins Grid-14 (2 x 7)-
Pitch Mating-0.100" (2.54mm)-
Contact Finish Mating-Gold-
Pitch Post-0.100" (2.54mm)-
Contact Finish Post-Tin-Lead-
Contact Finish Thickness Mating-25μin (0.63μm)-
Contact Material Mating-Copper Alloy-
Contact Finish Thickness Post-80μin (2.03μm)-
Contact Material Post-Copper Alloy-
Number of Positions--14 Position
Termination Style--Through Hole
Operating Temperature Range--- 55 C to + 105 C
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