PartNumber | 808-AG11D-ES | 808-AG11DESL | 808-AG11D-ES-LF |
Description | IC & Component Sockets 8 PIN ECONOMY | IC & Component Sockets SOCKET ASSEMBLY | IC & Component Sockets DIP .3CL 08P S&R OFRM AU/SN |
Manufacturer | TE Connectivity | - | TE Connectivity AMP Connectors |
Product Category | IC & Component Sockets | - | Sockets for ICs, Transistors |
RoHS | N | - | - |
Pitch | 2.54 mm | - | - |
Contact Plating | Gold | - | - |
Brand | TE Connectivity / AMP | - | - |
Contact Material | Beryllium Copper | - | - |
Mounting Style | PCB | - | - |
Maximum Operating Temperature | + 125 C | - | - |
Minimum Operating Temperature | - 55 C | - | - |
Product Type | IC & Component Sockets | - | - |
Factory Pack Quantity | 60 | - | - |
Subcategory | IC & Component Sockets | - | - |
Part # Aliases | 1437539-5 | - | - |
Series | - | - | 800 |
Type | - | - | DIP, 0.3" (7.62mm) Row Spacing |
Packaging | - | - | Tube |
Termination | - | - | Solder |
Operating Temperature | - | - | -55°C ~ 105°C |
Mounting Type | - | - | Through Hole |
Features | - | - | Open Frame |
Housing Material | - | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Number of Positions or Pins Grid | - | - | 8 (2 x 4) |
Pitch Mating | - | - | 0.100" (2.54mm) |
Contact Finish Mating | - | - | Gold |
Pitch Post | - | - | 0.100" (2.54mm) |
Contact Finish Post | - | - | Gold |
Contact Finish Thickness Mating | - | - | 20μin (0.51μm) |
Contact Material Mating | - | - | Beryllium Copper |
Contact Finish Thickness Post | - | - | 20μin (0.51μm) |
Contact Material Post | - | - | Copper |