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| PartNumber | 2-1571586-2 | 2-1571586-3 | 2-1571586-4 |
| Description | 808-AG11D-LF=800 DIP,PCB,AU/SN | CONN IC DIP SOCKET 14POS GOLD | CONN IC DIP SOCKET 16POS GOLD |
| Manufacturer | TE Connectivity AMP Connectors | - | - |
| Product Category | Sockets for ICs, Transistors | - | - |
| Series | 800 | - | - |
| Type | DIP, 0.3" (7.62mm) Row Spacing | - | - |
| Packaging | Tube | - | - |
| Termination | Solder | - | - |
| Operating Temperature | -55°C ~ 105°C | - | - |
| Mounting Type | Through Hole | - | - |
| Features | Open Frame | - | - |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | - |
| Number of Positions or Pins Grid | 8 (2 x 4) | - | - |
| Pitch Mating | 0.100" (2.54mm) | - | - |
| Contact Finish Mating | Gold | - | - |
| Pitch Post | 0.100" (2.54mm) | - | - |
| Contact Finish Post | Gold | - | - |
| Contact Finish Thickness Mating | 25μin (0.63μm) | - | - |
| Contact Material Mating | Beryllium Copper | - | - |
| Contact Finish Thickness Post | 25μin (0.63μm) | - | - |
| Contact Material Post | Copper | - | - |