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| PartNumber | 208-7 | 208-75CTE | 208-7391-55-1902 |
| Description | Cable Mounting & Accessories | Heat Sinks Heatsink for TO-220, Copper, Channel Style, 19.05x19.05x9.52mm | IC & Component Sockets BURN-IN SOIC SOCKET 8 Leads |
| Manufacturer | Heyco | Wakefield-Vette | 3M |
| Product Category | Cable Mounting & Accessories | Heat Sinks | Sockets for ICs, Transistors |
| Product Type | Cable Mounts | Heat Sinks | - |
| Brand | Heyco | Wakefield-Vette | - |
| Subcategory | Wire & Cable Management | Heat Sinks | - |
| RoHS | - | Y | - |
| Product | - | Heat Sinks | - |
| Mounting Style | - | Through Hole | - |
| Heatsink Material | - | Copper | - |
| Length | - | 9.53 mm | - |
| Width | - | 19.05 mm | - |
| Height | - | 19.05 mm | - |
| Designed for | - | TO-220 | - |
| Color | - | Gray | - |
| Series | - | 208 | Textool |
| Type | - | Heat Sink | SOIC |
| Factory Pack Quantity | - | 3000 | - |
| Packaging | - | - | Bulk |
| Termination | - | - | Solder |
| Operating Temperature | - | - | -55°C ~ 150°C |
| Mounting Type | - | - | Through Hole |
| Features | - | - | Closed Frame |
| Housing Material | - | - | Polyethersulfone (PES), Glass Filled |
| Number of Positions or Pins Grid | - | - | 8 (2 x 4) |
| Pitch Mating | - | - | - |
| Contact Finish Mating | - | - | Gold |
| Pitch Post | - | - | - |
| Contact Finish Post | - | - | Gold |
| Contact Finish Thickness Mating | - | - | 30μin (0.76μm) |
| Contact Material Mating | - | - | Beryllium Copper |
| Contact Finish Thickness Post | - | - | 30μin (0.76μm) |
| Contact Material Post | - | - | Beryllium Copper |