SIGC15T60UNX1SA1

SIGC15T60UNX1SA1
Mfr. #:
SIGC15T60UNX1SA1
Produttore:
Infineon Technologies AG
Descrizione:
IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T60UNX1SA1)
Ciclo vitale:
Nuovo da questo produttore.
Scheda dati:
SIGC15T60UNX1SA1 Scheda dati
Consegna:
DHL FedEx Ups TNT EMS
Pagamento:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Attributo del prodotto
Valore attributo
Tags
SIGC15T60, SIGC15T, SIGC15, SIGC1, SIGC, SIG
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ineon
Infineon's High Speed IGBT 2 family is a non punch-through IGBT technology with low switching losses and high robustness. | Summary of Features: Positive temperature coefficient; Easy paralleling | Target Applications: UPS; Welding
Parte # Mfg. Descrizione Azione Prezzo
SIGC15T60UNX1SA1
DISTI # SIGC15T60UNX1SA1
Infineon Technologies AGIGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T60UNX1SA1)
RoHS: Compliant
Min Qty: 270
Container: Waffle Pack
Americas - 0
  • 2700:$1.0900
  • 540:$1.1900
  • 810:$1.1900
  • 1350:$1.1900
  • 270:$1.2900
Immagine Parte # Descrizione
SIGC15T60EX1SA4

Mfr.#: SIGC15T60EX1SA4

OMO.#: OMO-SIGC15T60EX1SA4-1190

Trans IGBT Chip N-CH 600V DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T60EX1SA4)
SIGC15T60SEX1SA2

Mfr.#: SIGC15T60SEX1SA2

OMO.#: OMO-SIGC15T60SEX1SA2-1190

Trans IGBT Chip N-CH 600V DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T60SEX1SA2)
SIGC15T60UNX1SA1

Mfr.#: SIGC15T60UNX1SA1

OMO.#: OMO-SIGC15T60UNX1SA1-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T60UNX1SA1)
SIGC15T65EX1SA1

Mfr.#: SIGC15T65EX1SA1

OMO.#: OMO-SIGC15T65EX1SA1-1190

IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC15T65EX1SA1)
Disponibilità
Azione:
Available
Su ordine:
1500
Inserisci la quantità:
Il prezzo attuale di SIGC15T60UNX1SA1 è solo di riferimento, se si desidera ottenere il prezzo migliore, inviare una richiesta o inviare un'e-mail diretta al nostro team di vendita [email protected]
Prezzo di riferimento (USD)
Quantità
Prezzo unitario
est. Prezzo
1
1,64 USD
1,64 USD
10
1,55 USD
15,53 USD
100
1,47 USD
147,15 USD
500
1,39 USD
694,90 USD
1000
1,31 USD
1 308,00 USD
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