DH8900CC S LJW2

DH8900CC S LJW2
Mfr. #:
DH8900CC S LJW2
Produttore:
Intel
Descrizione:
Chipsets 8900 Chipset Server FCBGA-942
Ciclo vitale:
Nuovo da questo produttore.
Scheda dati:
DH8900CC S LJW2 Scheda dati
Consegna:
DHL FedEx Ups TNT EMS
Pagamento:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Maggiori informazioni:
DH8900CC S LJW2 maggiori informazioni
Attributo del prodotto
Valore attributo
Produttore:
Intel
Categoria di prodotto:
Chipset
RoHS:
Y
Serie:
8900
Prodotto:
Chipset server
Serie di chip:
8900
Tipo:
PCH
Nome in codice:
Cave Creek
Opzioni incorporate:
Incorporato
Revisione PCIe:
1.0
Configurazioni PCIe:
4 Lanes
Grafica integrata:
Senza grafica
Numero di porte USB:
6
Numero di porte SATA:
2
TDP - Massimo:
8.5 W
Temperatura massima di esercizio:
+ 103 C
Pacchetto/custodia:
FCBGA-942
Confezione:
Vassoio
Lunghezza:
27 mm
Larghezza:
27 mm
Marca:
Intel
Stile di montaggio:
SMD/SMT
Configurazione CPU - Massimo:
2
Sensibile all'umidità:
Tipologia di prodotto:
Chipset
Quantità confezione di fabbrica:
1
sottocategoria:
Chipset
Revisione USB:
2.0
Parte # Alias:
923820
Tags
DH8900CCS, DH8900C, DH8900, DH890, DH89, DH8
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
Communication Chipset 942-Pin FC-BGA Tray
***ical
Communications Chip 942-Pin FCBGA Tray
*** Electronic Components
Chipsets 8900 Chipset Server FCBGA-942
Server Chipsets
Intel's Server Chipsets provides extensive I/O support with functions and capabilities that include PCI Express, PCI Local Bus, ACPI power management, enhanced DMA controller, Serial ATA, USB host interface, integrated 10/100/1000 Gigabit Ethernet MAC, and system management bus (SMBus) with additional support for I2C devices. These chipsets provide support for Intel High Definition Audio, Rapid Storage Technology, Active Management Technology, Virtualization Technology for Directed I/O, Trusted Execution Technology, Flexible Display Interconnect, Anti-Theft Technology, and JTAG Boundary Scan support.Learn More
89xx Communication Chipsets
Intel's 89xx Communication Chipsets are a platform controller hub (PCH) that includes standard PC interfaces (e.g., PCI Express, SATA, USB, etc.) along with Intel QuickAssist Technology and I/O interfaces. The PCH can be accessed by the IA processor via two interfaces: a DMI interface that provides connectivity to the standard PC interfaces and a PCI Express interface that provides connectivity to the PCH's PCI Express End Point (EP) for Intel QuickAssist Technology and access to the GbE MACs. These interfaces are not dependent on one another and can be used independently in a system.Learn More
Parte # Mfg. Descrizione Azione Prezzo
DH8900CCS LJW2
DISTI # V99:2348_07313339
Intel CorporationPlatform Controller Hub Tray
RoHS: Compliant
1
  • 200:$43.3800
  • 50:$44.8000
  • 10:$46.3000
  • 1:$47.8900
DH8900CC S LJW2
DISTI # C1S325900208823
Intel CorporationCommunications Chipset Tray
RoHS: Compliant
1
  • 1:$47.8900
DH8900CC SLJW2
DISTI # DH8900CCS LJW2
Intel CorporationCommunication Chipset 942-Pin FC-BGA Tray - Trays (Alt: DH8900CCS LJW2)
RoHS: Compliant
Min Qty: 1
Container: Tray
Americas - 0
  • 1:$47.5900
  • 10:$46.9900
  • 25:$46.3900
  • 50:$45.7900
  • 100:$45.1900
  • 500:$44.5900
  • 1000:$43.9900
DH8900CC S LJW2
DISTI # 607-DH8900CCSLJW2
Intel CorporationChipsets 8900 Chipset Server FCBGA-942
RoHS: Compliant
7
  • 1:$49.2900
  • 10:$47.9400
  • 50:$46.6600
Immagine Parte # Descrizione
904-27-1-23-2-B-0

Mfr.#: 904-27-1-23-2-B-0

OMO.#: OMO-904-27-1-23-2-B-0

Heat Sinks Chipset Heatsink with Clip, Elliptical, 27mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
904-27-2-23-2-B-0

Mfr.#: 904-27-2-23-2-B-0

OMO.#: OMO-904-27-2-23-2-B-0

Heat Sinks Chipset Heatsink with Clip, Pin Fin, 27mm Chip Size, 22.6mm Height, Aluminum, Black Anodized
904-27-1-12-2-B-0

Mfr.#: 904-27-1-12-2-B-0

OMO.#: OMO-904-27-1-12-2-B-0

Heat Sinks Chipset Heatsink with Clip, Elliptical, 27mm Chip Size, 11.6mm Height, Aluminum, Black Anodized
904-27-2-12-2-B-0

Mfr.#: 904-27-2-12-2-B-0

OMO.#: OMO-904-27-2-12-2-B-0-WAKEFIELD

BOARD LEVEL HEAT SINK
904-27-1-12-2-B-0

Mfr.#: 904-27-1-12-2-B-0

OMO.#: OMO-904-27-1-12-2-B-0-WAKEFIELD

HEATSINK 27X27X12MM ELLIPTICAL
904-27-1-23-2-B-0

Mfr.#: 904-27-1-23-2-B-0

OMO.#: OMO-904-27-1-23-2-B-0-WAKEFIELD

Elliptical Fin Heat Sink
904-27-2-23-2-B-0

Mfr.#: 904-27-2-23-2-B-0

OMO.#: OMO-904-27-2-23-2-B-0-WAKEFIELD

BOARD LEVEL HEAT SINK
Disponibilità
Azione:
Available
Su ordine:
1989
Inserisci la quantità:
Il prezzo attuale di DH8900CC S LJW2 è solo di riferimento, se si desidera ottenere il prezzo migliore, inviare una richiesta o inviare un'e-mail diretta al nostro team di vendita [email protected]
Prezzo di riferimento (USD)
Quantità
Prezzo unitario
est. Prezzo
1
49,29 USD
49,29 USD
10
47,94 USD
479,40 USD
50
46,66 USD
2 333,00 USD
200
45,45 USD
9 090,00 USD
A causa della scarsità di semiconduttori dal 2021, il prezzo inferiore è il prezzo normale prima del 2021. Si prega di inviare informazioni per confermare.
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