BDN09-3CB/A01

Mfr. #:: BDN09-3CB/A01
Produttore:: CTS Thermal Management Products
Descrizione:: Heat Sink Passive Pin Array Adhesive 26.9C/W Black Anodized
Ciclo vitale:: Nuovo da questo produttore.
Scheda dati:: BDN09-3CB/A01 Scheda dati
Consegna:: DHL FedEx Ups TNT EMS
Pagamento:: T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:: BDN09-3CB/A01 Datasheet
ECAD Model:

Attributo del prodotto
Valore attributo

Produttore: Prodotti per la gestione termica CTS

categoria di prodotto: Termico - Dissipatori di calore

Materiale: Alluminio

Serie: BDN

Tipo: Montaggio superiore

Lunghezza: 0.910" (23.11mm)

Larghezza: 0.910" (23.11mm)

Forma: Quadrati, pinne a spillo

Diametro: -

Raffreddato a pacchetto: Assortimento (BGA, LGA, CPU, ASIC...)

Metodo di attaccamento: Nastro termico, adesivo (incluso)

Altezza-Off-Base-Altezza-della-pinna: 0.355" (9.02mm)

Potenza-Dissipazione-Temperatura-Aumento: -

Termoresistenza-Forzato-Flusso d'Aria: 9.6°C/W @ 400 LFM

Termoresistenza-Naturale: 26.9°C/W

Materiale-Finitura: Anodizzato nero

Tags: BDN0, BDN

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

Market price

Parte #	Mfg.	Descrizione	Azione	Prezzo
BDN09-3CB/A01 DISTI # V36:1790_07764761	CTS Corporation	Heat Sink Passive Pin Array Adhesive 26.9C/W Black Anodized RoHS: Compliant	2000	5000:$1.5659 1000:$1.6150 500:$1.8900 250:$1.9890 100:$2.0320 50:$2.0930 25:$2.2120 10:$2.2810 1:$2.5740
BDN09-3CB/A01 DISTI # 294-1097-ND	CTS Corporation	HEATSINK CPU W/ADHESIVE .91"SQ RoHS: Compliant Min Qty: 1 Container: Box	4596In Stock	5000:$1.7047 1000:$1.7382 500:$1.9387 250:$2.0056 100:$2.1393 50:$2.2730 25:$2.4068 10:$2.4740 1:$2.5400
BDN09-3CB/A01 DISTI # 33919562	CTS Corporation	Heat Sink Passive Pin Array Adhesive 26.9C/W Black Anodized RoHS: Compliant	2000	1000:$2.5469
BDN09-3CB/A01 DISTI # 33627596	CTS Corporation	Heat Sink Passive Pin Array Adhesive 26.9C/W Black Anodized RoHS: Compliant	2000	4:$2.5740
BDN09-3CB/A01 DISTI # BDN09-3CB/A01	CTS Corporation	Heat Sink Passive Pin Array Adhesive 26.9°C/W Black Anodized - Trays (Alt: BDN09-3CB/A01) RoHS: Compliant Min Qty: 1000 Container: Tray	Americas - 11870	10000:$1.2900 3000:$1.3900 5000:$1.3900 1000:$1.5900 2000:$1.5900
BDN09-3CB/A01	CTS Corporation	Peel And Stick Black Anodized Heat Dissipator RoHS: Compliant	3000Bulk	1000:$1.5500
BDN093CBA01 DISTI # 774-BDN093CBA01	CTS Corporation	Heat Sinks IERC Heat Sink 0.91x0.91x0.355 RoHS: Compliant	2617	1:$2.3500 10:$2.2900 25:$2.2200 50:$2.1000 100:$1.9800 250:$1.8500 500:$1.7900 1000:$1.6000 5000:$1.5700
BDN09-3CB/A01	CTS Corporation	Heat Sink Passive Pin Array Adhesive 26.9°C/W Black Anodized RoHS: Compliant	3500 In Stock	1:$2.3300 25:$2.2500 50:$2.0500 100:$1.7000
BDN09-3CB/A01	CTS Corporation	HEATSINK CPU W/ADHESIVE .91"SQ	2	3:$2.9800 1:$4.4700
BDN09-3CB/A01	C TS	HEATSINK CPU W/ADHESIVE .91"SQ	722	364:$2.4585 85:$2.7565 1:$4.4700
BDN09-3CB/A01	IERC	HEATSINK CPU W/ADHESIVE .91"SQ	32	12:$6.0000 4:$6.6000 1:$9.0000
BDN09-3CB/A01 DISTI # BDN093CBA01	CTS Corporation		3500	1:$2.3300 25:$2.2500 50:$2.0500 100:$1.7000 250:$1.5900 500:$1.5100 1000:$1.4900
BDN09-3CB/A01 DISTI # XSFP00000040572	CTS CORPORATION	RoHS: Compliant	2000 in Stock0 on Order	2000:$2.0700 1000:$2.2100

Prodotti correlati

Immagine

Parte #

Descrizione

Mfr.#: BDN09-3CB

OMO.#: OMO-BDN09-3CB-CTS-ELECTRONIC-COMPONENTS

HEATSINK CPU .91" SQ

Mfr.#: BDN09-3CB/A01

OMO.#: OMO-BDN09-3CB-A01-CTS-ELECTRONIC-COMPONENTS

Heat Sink Passive Pin Array Adhesive 26.9C/W Black Anodized

Disponibilità

Azione:: Available
Su ordine:: 2000
Inserisci la quantità:

Il prezzo attuale di BDN09-3CB/A01 è solo di riferimento, se si desidera ottenere il prezzo migliore, inviare una richiesta o inviare un'e-mail diretta al nostro team di vendita [email protected]

Prezzo di riferimento (USD)

Quantità
Prezzo unitario
est. Prezzo

1: ~~2,08 USD~~; ~~2,08 USD~~

10: ~~1,98 USD~~; ~~19,81 USD~~

100: ~~1,88 USD~~; ~~187,65 USD~~

500: ~~1,77 USD~~; ~~886,15 USD~~

1000: ~~1,67 USD~~; ~~1 668,00 USD~~

Iniziare con

BDN0 3
BDN 36

Prodotti più recenti

IO-Link™ Devices

Maxim Integrated’s complete portfolio of IO-link devices integrate value-adding features to provide design flexibility and offload the local processor.
Large Diameter Clear Hole Spacers

RAF's large diameter clear hole spacers for industrial applications are available in standard stock sizes, various materials and finishes, and custom options.
Compare BDN09-3CB/A01

BDN0153 vs BDN093CB vs BDN093CBA01
WE-ExB Series Common Mode Power Line Choke

Wurth's WE-ExB series is the double core made of MnZn and NiZn. Its insertion loss has a range of effect over a broader frequency range than does a single NiZn or MnZn core.
CPI2-B1-REU Production Device Programmer

Phyton's CPI2-B1-REU in-system programmer supports Renesas microcontrollers, memory devices, and MCUs from other manufacturers.
CFSH05-20L Schottky Diode

Central Semiconductor's space saving, low profile Schottky diode for applications including DC-DC conversion and circuit protection.

More Newest Products

BDN09-3CB/A01

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes