2227MC-08-03-18-F1

2227MC-08-03-18-F1
Mfr. #:
2227MC-08-03-18-F1
Produttore:
SPC Multicomp
Descrizione:
CONNECTOR, DIP SOCKET, 8 WAY, PC BOARD, No. of Contacts:8Contacts, Connector Type:DIP Socket, Pitch Spacing:2.54mm, Product Range:2227MC Series, Row Pitch:7.62mm, Contact Material:Phosphor Bronz
Ciclo vitale:
Nuovo da questo produttore.
Scheda dati:
2227MC-08-03-18-F1 Scheda dati
Consegna:
DHL FedEx Ups TNT EMS
Pagamento:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Attributo del prodotto
Valore attributo
Tags
2227M, 2227, 222
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ment14 APAC
SOCKET IC, DIL, 0.3", 8WAY; No. of Contacts:8Contacts; Connector Type:DIP Socket; Pitch Spacing:2.54mm; Product Range:2227MC Series; Row
***roFlash
IC Socket, DIP8, 8 Contact(s)
***th Star Micro
SOCKET IC, DIL, 0.3, 8WAY
***nell
SOCKET IC, DIL, 0.3", 8WAY; No. of Contacts: 8Contacts; Connector Type: DIP Socket; Pitch Spacing: 2.54mm; Product Range: 2227MC Series; Row Pitch: 7.62mm; Contact Material: Phosphor Bronze; Contact Plating: Tin Plated Contacts; SVHC: No SVHC (15-Jan-2019); Connector Mounting Orientation: PC Board; Contact Termination: Through Hole Vertical; Contact Termination Type: Through Hole; External Depth: 7.4mm; External Length / Height: 10.16mm; External Width: 10.16mm; Insulation Resistance: 1000Mohm; Lead Spacing: 2.54mm; Operating Temperature Max: 125°C; Operating Temperature Min: -55°C; Pin Format: DIP; Tube Quantity: 1
Parte # Mfg. Descrizione Azione Prezzo
2227MC-08-03-18-F1
DISTI # 98K7077
SPC MulticompCONNECTOR, DIP SOCKET, 8 WAY, PC BOARD,No. of Contacts:8Contacts,Connector Type:DIP Socket,Pitch Spacing:2.54mm,Product Range:2227MC Series,Row Pitch:7.62mm,Contact Material:Phosphor Bronze,Contact Plating:Tin Plated Contacts RoHS Compliant: Yes2173
  • 5000:$0.2210
  • 1000:$0.2420
  • 500:$0.2710
  • 250:$0.3030
  • 1:$0.4020
2227MC-08-03-18-F1
DISTI # 1103844
SPC MulticompSOCKET IC, DIL, 0.3", 8WAY
RoHS: Compliant
48773
  • 1500:£0.0855
  • 1000:£0.0901
  • 500:£0.1130
  • 150:£0.1320
  • 10:£0.1880
2227MC-08-03-18-F1
DISTI # 1103844
SPC MulticompSOCKET IC, DIL, 0.3", 8WAY
RoHS: Compliant
38007
  • 1000:$0.1810
  • 500:$0.2060
  • 250:$0.2340
  • 100:$0.2740
  • 1:$0.3150
Immagine Parte # Descrizione
2227MC-08-03-18-F1

Mfr.#: 2227MC-08-03-18-F1

OMO.#: OMO-2227MC-08-03-18-F1-1190

CONNECTOR, DIP SOCKET, 8 WAY, PC BOARD, No. of Contacts:8Contacts, Connector Type:DIP Socket, Pitch Spacing:2.54mm, Product Range:2227MC Series, Row Pitch:7.62mm, Contact Material:Phosphor Bronz
Disponibilità
Azione:
Available
Su ordine:
5000
Inserisci la quantità:
Il prezzo attuale di 2227MC-08-03-18-F1 è solo di riferimento, se si desidera ottenere il prezzo migliore, inviare una richiesta o inviare un'e-mail diretta al nostro team di vendita [email protected]
Prezzo di riferimento (USD)
Quantità
Prezzo unitario
est. Prezzo
1
0,33 USD
0,33 USD
10
0,31 USD
3,15 USD
100
0,30 USD
29,84 USD
500
0,28 USD
140,90 USD
1000
0,27 USD
265,20 USD
A causa della scarsità di semiconduttori dal 2021, il prezzo inferiore è il prezzo normale prima del 2021. Si prega di inviare informazioni per confermare.
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