MP2-PS030-51S1-LR

MP2-PS030-51S1-LR
Mfr. #:
MP2-PS030-51S1-LR
Produttore:
3M
Descrizione:
High Speed / Modular Connectors INVERS HDR SLDR TAIL 30 PIN 5 ROWS
Ciclo vitale:
Nuovo da questo produttore.
Scheda dati:
MP2-PS030-51S1-LR Scheda dati
Consegna:
DHL FedEx Ups TNT EMS
Pagamento:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
MP2-PS030-51S1-LR DatasheetMP2-PS030-51S1-LR Datasheet (P4-P5)
ECAD Model:
Attributo del prodotto
Valore attributo
Produttore:
3M
Categoria di prodotto:
Connettori modulari/ad alta velocità
Serie:
MP2
Marca:
3M Electronic Solutions Division
Tipologia di prodotto:
Connettori modulari/ad alta velocità
Quantità confezione di fabbrica:
840
sottocategoria:
Connettori backplane
Parte # Alias:
05111174474 80000916702
Unità di peso:
0.193415 oz
Tags
MP2-PS0, MP2-PS, MP2-P, MP2
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***et
3M MetPak 2-FB Inverse Header 2 mm 5-Row, Stacking, Solder or Press-Fit Tail
***ied Electronics & Automation
80000916702 MP2-PS030-51S1-LR =MP2/SKT/INV/30P/5R
***i-Key
CONN HEADER FUTUREBUS+ 30POS PCB
Parte # Mfg. Descrizione Azione Prezzo
MP2-PS030-51S1-LR
DISTI # 3M5507-ND
3M InterconnectCONN HEADER FUTUREBUS+ 30POS PCB
RoHS: Compliant
Min Qty: 840
Container: Tube
Temporarily Out of Stock
  • 840:$4.5300
MP2-PS030-51S1-LR
DISTI # 05111174474
3M Interconnect3M MetPak 2-FB Inverse Header 2 mm 5-Row, Stacking, Solder or Press-Fit Tail - Bulk (Alt: 05111174474)
RoHS: Compliant
Min Qty: 840
Container: Bulk
Americas - 0
    MP2-PS030-51S1-LR
    DISTI # 517-MP2-PS030-51S1LR
    3M InterconnectHigh Speed / Modular Connectors INVERS HDR SLDR TAIL 30 PIN 5 ROWS0
    • 840:$4.8300
    Immagine Parte # Descrizione
    MP2-PS030-51S1-LR

    Mfr.#: MP2-PS030-51S1-LR

    OMO.#: OMO-MP2-PS030-51S1-LR

    High Speed / Modular Connectors INVERS HDR SLDR TAIL 30 PIN 5 ROWS
    MP2-PS030-51P1-TR30

    Mfr.#: MP2-PS030-51P1-TR30

    OMO.#: OMO-MP2-PS030-51P1-TR30

    High Speed / Modular Connectors MP2/HDR/INVSTKG/30P 5R/4.03MMPRFT/30PDNI
    MP2-PS030-51S1-LR

    Mfr.#: MP2-PS030-51S1-LR

    OMO.#: OMO-MP2-PS030-51S1-LR-3M

    High Speed / Modular Connectors INVERS HDR SLDR TAIL 30 PIN 5 ROWS
    Disponibilità
    Azione:
    Available
    Su ordine:
    3000
    Inserisci la quantità:
    Il prezzo attuale di MP2-PS030-51S1-LR è solo di riferimento, se si desidera ottenere il prezzo migliore, inviare una richiesta o inviare un'e-mail diretta al nostro team di vendita [email protected]
    Iniziare con
    Prodotti più recenti
    • 588 Thermal Bonding Film
      3M™ 588 thermal bonding film is a high strength, flexible, nitrile phenolic based thermosetting adhesive film that is a thicker version of the 583 film.
    • Twin Axial Cables
      Available in four-channel, 100 Ω, 30 AWG versions, 3M™'s SL8800 series cable is the optimum solution for space-constrained systems.
    • D89 Series Socket Assemblies and 3365 Series Flat
      Digi-Key is expanding its extensive 3M™ value-added assembly program with ready-to-install IDC assemblies constructed with the D89 socket series.
    • Input/Output Interconnect System
      3M™'s I/O interconnect system allows designers flexibility in the location of power supplies to peripheral devices.
    • Compare MP2-PS030-51S1-LR
      MP2PS03051P1TR30 vs MP2PS03051S1LR vs MP2PS09051S1KR
    • Mini Delta Ribbon Transmission Cable Assembly
      3M™'s MDR high-speed transmission system is a digital interconnect system designed to meet the needs of today's high-performance data transmission applications.
    Top