BCM11140IFEBG

BCM11140IFEBG
Mfr. #:
BCM11140IFEBG
Produttore:
Broadcom Limited
Descrizione:
DUAL-A9 CPU, 14X14 PACKAGE, A3 V
Ciclo vitale:
Nuovo da questo produttore.
Scheda dati:
BCM11140IFEBG Scheda dati
Consegna:
DHL FedEx Ups TNT EMS
Pagamento:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Attributo del prodotto
Valore attributo
Produttore
AMPIO
categoria di prodotto
Chip IC
Tags
BCM111, BCM11, BCM1, BCM
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
Parte # Mfg. Descrizione Azione Prezzo
BCM11140IFEBG
DISTI # BCM11140IFEBG-ND
Broadcom LimitedDUAL-A9 CPU, 14X14 PACKAGE, A3 V
RoHS: Compliant
Min Qty: 99
Container: Bulk
Temporarily Out of Stock
  • 99:$40.8315
BCM11140IFEBG
DISTI # BCM11140IFEBG
Broadcom LimitedNetwork Processor 1GHz BCM11140 Parallel FPB4NGS - Trays (Alt: BCM11140IFEBG)
RoHS: Compliant
Min Qty: 99
Container: Tray
Americas - 0
  • 990:$30.3900
  • 495:$31.0900
  • 297:$31.8900
  • 198:$32.7900
  • 99:$33.1900
BCM11140IFEBG
DISTI # 630-BCM11140IFEBG
Broadcom LimitedBroadcom Limited Dual-A9 CPU, 14x14 package, A3 version0
  • 99:$37.7200
  • 100:$36.6400
Immagine Parte # Descrizione
BCM11107KFBG

Mfr.#: BCM11107KFBG

OMO.#: OMO-BCM11107KFBG

Network Controller & Processor ICs IP PHONE CHIP
BCM11125IFEBG

Mfr.#: BCM11125IFEBG

OMO.#: OMO-BCM11125IFEBG-1190

MAP/AP-ONLY - Trays (Alt: BCM11125IFEBG)
BCM111301FEBG

Mfr.#: BCM111301FEBG

OMO.#: OMO-BCM111301FEBG-1190

Nuovo e originale
BCM11130IFEBG P12

Mfr.#: BCM11130IFEBG P12

OMO.#: OMO-BCM11130IFEBG-P12-1190

Nuovo e originale
BCM11130IFEBG P13

Mfr.#: BCM11130IFEBG P13

OMO.#: OMO-BCM11130IFEBG-P13-1190

Nuovo e originale
BCM1113KPBG P30

Mfr.#: BCM1113KPBG P30

OMO.#: OMO-BCM1113KPBG-P30-1190

Nuovo e originale
BCM1113RKPBG-P30

Mfr.#: BCM1113RKPBG-P30

OMO.#: OMO-BCM1113RKPBG-P30-1190

Nuovo e originale
BCM11170KFBG

Mfr.#: BCM11170KFBG

OMO.#: OMO-BCM11170KFBG-1190

IP PHONE CHIP
BCM11181IFBGP21

Mfr.#: BCM11181IFBGP21

OMO.#: OMO-BCM11181IFBGP21-1190

Nuovo e originale
BCM11188KFBG

Mfr.#: BCM11188KFBG

OMO.#: OMO-BCM11188KFBG-1190

IP PHONE CHIP - Bulk (Alt: BCM11188KFBG)
Disponibilità
Azione:
Available
Su ordine:
1000
Inserisci la quantità:
Il prezzo attuale di BCM11140IFEBG è solo di riferimento, se si desidera ottenere il prezzo migliore, inviare una richiesta o inviare un'e-mail diretta al nostro team di vendita [email protected]
Prezzo di riferimento (USD)
Quantità
Prezzo unitario
est. Prezzo
1
46,64 USD
46,64 USD
10
44,30 USD
443,03 USD
100
41,97 USD
4 197,15 USD
500
39,64 USD
19 819,90 USD
1000
37,31 USD
37 308,00 USD
Iniziare con
Prodotti più recenti
  • L-Series Magnetic Switches
    The L-series from Magnasphere offers remarkable ferrous-metal proximity sensing. Unlike typical reed switch devices, they need no magnet actuator.
  • Magi³C-FISM Fixed Isolated SIP Module
    Würth Elektronik's MagI³C-FISM 1 W functional isolated DC/DC converter features an Isolation voltage of 2 kV.
  • REC20 and RES20 Optical Encoders
    Nidec Copal Electronics' REC20 and RES20 optical encoders are for use in applications that require manual setting and are available in multiple resolution options.
  • BMM150 Geomagnetic Sensors
    Bosch’s BMM150 is a low-power and low-noise 3-axis digital geomagnetic sensor to be used in compass applications.
  • Ultra-Low Dropout Voltage LDO
    Toshiba's TCR series are compactly packaged LDOs that offer high performance and low noise making them ideal for small form-factor applications.
Top