SIDC112D170HX1SA2

SIDC112D170HX1SA2
Mfr. #:
SIDC112D170HX1SA2
Produttore:
Infineon Technologies AG
Descrizione:
DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC112D170HX1SA2)
Ciclo vitale:
Nuovo da questo produttore.
Scheda dati:
SIDC112D170HX1SA2 Scheda dati
Consegna:
DHL FedEx Ups TNT EMS
Pagamento:
T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Attributo del prodotto
Valore attributo
Tags
SIDC11, SIDC1, SIDC, SID
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***ineon
Emitter Controlled Diode is Infineon's unique Fast Recovery Diode technology. The ultrathin wafer and Fieldstop technology makes the Emitter Controlled Diode ideally suited for consumer and industry applications as it lowers the turn-on losses of the IGBT with soft recovery. The Emitter Controlled Diode is optimized for Infineon IGBT technology. | Summary of Features: Soft, fast switching; Low reverse recovery charge; Small temperature coefficient | Target Applications: Industrial drives; Resonant applications
Parte # Mfg. Descrizione Azione Prezzo
SIDC112D170HX1SA2
DISTI # SIDC112D170HX1SA2
Infineon Technologies AGDIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC112D170HX1SA2)
RoHS: Compliant
Min Qty: 29
Container: Waffle Pack
Americas - 0
  • 29:$12.4900
  • 31:$12.0900
  • 60:$11.5900
  • 145:$11.1900
  • 290:$10.9900
Immagine Parte # Descrizione
SIDC112D170HX1SA2

Mfr.#: SIDC112D170HX1SA2

OMO.#: OMO-SIDC112D170HX1SA2-1190

DIODEN CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIDC112D170HX1SA2)
Disponibilità
Azione:
Available
Su ordine:
1500
Inserisci la quantità:
Il prezzo attuale di SIDC112D170HX1SA2 è solo di riferimento, se si desidera ottenere il prezzo migliore, inviare una richiesta o inviare un'e-mail diretta al nostro team di vendita [email protected]
Prezzo di riferimento (USD)
Quantità
Prezzo unitario
est. Prezzo
1
16,48 USD
16,48 USD
10
15,66 USD
156,61 USD
100
14,84 USD
1 483,65 USD
500
14,01 USD
7 006,15 USD
1000
13,19 USD
13 188,00 USD
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