AT45DB041E-DWF

Mfr. #:: AT45DB041E-DWF
Produttore:: Adesto Technologies
Descrizione:: NOR Flash Die in Wafer Form
Ciclo vitale:: Nuovo da questo produttore.
Scheda dati:: AT45DB041E-DWF Scheda dati
Consegna:: DHL FedEx Ups TNT EMS
Pagamento:: T/T Paypal Visa MoneyGram Western Union
ECAD Model:
Maggiori informazioni:: AT45DB041E-DWF maggiori informazioni

Attributo del prodotto
Valore attributo

Produttore:: Tecnologie Adesto

Categoria di prodotto:: NOR Flash

RoHS:: Y

Stile di montaggio:: SMD/SMT

Pacchetto/custodia:: Morire

Serie:: AT45DB041E

Dimensione della memoria:: 4 Mbit

Frequenza massima di clock:: 104 MHz

Tipo di interfaccia:: I2C

Organizzazione:: 512 k x 8

Larghezza bus dati:: 8 bit

Tensione di alimentazione - Min:: 1.65 V

Tensione di alimentazione - Max:: 3.6 V

Corrente di alimentazione - Max:: 16 mA

Temperatura di esercizio minima:: - 40 C

Temperatura massima di esercizio:: + 85 C

Tipo di memoria:: NÉ

Velocità:: 104 MHz

Architettura:: Cancellazione flessibile

Marca:: Tecnologie Adesto

Tipologia di prodotto:: NOR Flash

Quantità confezione di fabbrica:: 1

sottocategoria:: Memoria e archiviazione dati

Nome depositato:: DataFlash

Tags: AT45DB041E, AT45DB041, AT45DB04, AT45DB0, AT45DB, AT45D, AT45, AT4

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

AT45DB041E-DWF Descrizione

***et: Flash Serial-SPI 4Mbit 4M x 1bit DIE

AT45DB041E-DWF Maggiori informazioni

DataFlash™ SPI Memory: Adesto Technologies DataFlash™ SPI Memory devices are feature-rich, page-erase (as small as 256 bytes) SPI-compatible Serial Flash with advanced protection and security features. These devices provide developers with the most flexible, easy-to-use Serial Flash solution on the market to address virtually any application. Dual-I/O and Quad-I/O interface options provide the ability to double and quadruple read throughputs. The DataFlash™ SPI Memory devices provide system developers with an extremely flexible solution by utilizing a page-erase architecture to allow the smallest amount of data (as little as 256 bytes) to be erased compared to any other Flash solution.

Prodotti correlati

Immagine	Parte #	Descrizione
	Mfr.#: AT45DB081E-DWF OMO.#: OMO-AT45DB081E-DWF	NOR Flash Die in Wafer Form
	Mfr.#: AT45DB041E-SSHNHT-B OMO.#: OMO-AT45DB041E-SSHNHT-B-ADESTO-TECHNOLOGIES	Flash Memory 8-SOIC-N, EXT TEMP, NON-AECQ, 1.65V, TUBE
	Mfr.#: AT45DB011D-SH-T/B OMO.#: OMO-AT45DB011D-SH-T-B-1190	Nuovo e originale
	Mfr.#: AT45DB021D-SSH-T OMO.#: OMO-AT45DB021D-SSH-T-MICROCHIP-TECHNOLOGY	IC FLASH 2M SPI 66MHZ 8SOIC
	Mfr.#: AT45DB041B-SU OMO.#: OMO-AT45DB041B-SU-MICROCHIP-TECHNOLOGY	IC FLASH 4M SPI 20MHZ 8SOIC
	Mfr.#: AT45DB081D OMO.#: OMO-AT45DB081D-1190	Nuovo e originale
	Mfr.#: AT45DB081DSU OMO.#: OMO-AT45DB081DSU-1190	Nuovo e originale
	Mfr.#: AT45DB041D-SSU-2.5-SL383 OMO.#: OMO-AT45DB041D-SSU-2-5-SL383-ADESTO-TECHNOLOGIES	IC FLASH 4M SPI 50MHZ 8SOIC
	Mfr.#: AT45DB041E-UUN2B-T OMO.#: OMO-AT45DB041E-UUN2B-T-ADESTO-TECHNOLOGIES	IC FLASH 4M SPI 85MHZ 8WLCSP
	Mfr.#: AT45DB081D-SU-2.5-AD OMO.#: OMO-AT45DB081D-SU-2-5-AD-ADESTO-TECHNOLOGIES	IC FLASH 8M SPI 50MHZ 8SOIC

Disponibilità

Azione:: Available
Su ordine:: 4000
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Il prezzo attuale di AT45DB041E-DWF è solo di riferimento, se si desidera ottenere il prezzo migliore, inviare una richiesta o inviare un'e-mail diretta al nostro team di vendita [email protected]

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AT45DB041E-DWF

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes